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Handbook of Thermal Plasmas
This authoritative reference now in it's 2nd edition will contain many updates and new chapters. It presents a comprehensive review of the evolution...
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Vertical Ladders, Inclined Ladders and Handles
This chapter contains guidance related to the design of the different attributes of vertical ladders, inclined ladders, individual rung ladders and...
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General Provisions
The ability to survey/inspect the condition of a vessel is a principal means to help verify that the vessel’s structure is maintained to comply with...
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The Evolution from 2D to 3D PICs
Photonic Integrated Circuits (PICs) are pivotal in advancing telecommunications, data centers, and many other high-tech industries. However,...
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Case Studies and Real-World Applications
3D photonics has made substantial strides with real-world implementations that demonstrate its transformative potential across several high-impact...
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Design and Fabrication Techniques
The integration of photonic devices with CMOS (Complementary Metal-Oxide-Semiconductor) fabrication techniques has revolutionized the field of...
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Industry Trends and Future Directions
The field of 3D photonics is advancing rapidly, driven by the demand for photonic devices that are not only faster and more efficient but also highly...
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Modeling and Simulation Tools
The development of photonic integrated circuits (PICs) has driven the need for specialized design methodologies and tools that go beyond traditional...
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Means of Access Requirements and Interpretations
This chapter presents the means of access requirements as set forth in MSC.151(78), MSC Resolution MSC.158(78), and the associated IACS Unified...
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Applications of 3D Photonics
The integration of 3D photonics into telecommunications and data centers marks a transformative advancement, enabling far greater data transmission...
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Thermal Management in 3D PICs
As Photonic Integrated Circuits (PICs) transition from 2D to 3D architectures, they offer substantial benefits in terms of integration density,...
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Alignment and Packaging of 3D PICs
The precision alignment of components in 3D Photonic Integrated Circuits (PICs) is crucial for maintaining optical signal integrity and ensuring that...
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Fundamentals of Photonic Integrated Circuits
Photonics, the branch of science and technology focused on the generation, manipulation, and detection of light, has evolved into a pivotal field...
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Alternative Means of Access
This chapter provides guidance relating to the design of alternative means of access. IMO requirements, under certain circumstances, allow for the...
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Hatches
This chapter contains guidance related to the design of hatches. The guidance included in the figures and tables below provides the design attributes...
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Walkways, Ramps and Work Platforms
This Section contains design guidance for walkways, ramps and work platforms. The guidance included in the figures and tables below provides the...
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Introduction to 2D and 3D Photonics
Photonic Integrated Circuits (PICs) represent a significant advancement in the field of photonics, analogous to the role that electronic integrated...
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Heterogeneous and Hybrid Integration
The integration of photonic and electronic materials into a single platform, known as hybrid integration, represents a pivotal advancement for...
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Vision for the Future
3D photonics marks a transformative step in technology, paving the way for innovations across fields as diverse as telecommunications, computing,...
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Precision Machines
In this volume, the design, manufacture and control technology of precision machines are introduced to achieve the concrete requirements for...